High-density card socket saves PCB space

Edited by the Electronicstalk editorial team Feb 28, 2011Samtec has introduced a high-density socket featuring a bi-level mating design comprising two levels of contacts on a staggered 1mm centreline, which creates a card-effective 0.5mm pitch.

The Edge Rate High Density Edge Card Socket (BEC5 Series) is available with up to 140 I/Os in a 1 x 1.27mm-grid PCB pad layout, with four rows of contacts.

This system is suitable for high-speed applications benefiting from its rugged Edge Rate contacts, which are designed for superior impedance control and reduced broadside coupling with increased durability and cycle life.

The 0.5mm pitch high-density socket accepts standard 1.60mm' and 2.40mm-thick cards.

Additional features include weld tabs, alignment pins and lead-free solder charge terminations for easy board processing.

Tin-lead solder charges, as well as alternative platings and pin counts, are also available.

In addition to the new BEC5 Series 0.5mm pitch high-density system, Samtec's full line of High Speed Edge Rate Edge Card Sockets includes 0.8mm (HSEC8 Series) pitch in surface-mount and edge-mount designs for parallel, perpendicular and planar-board mating as well as a right-angle dual-stacking design (DSEC Series).

Stamped contact design sockets are also available in 0.635mm (MEC6 Series), 1mm (MEC1 Series), 1,27mm (MECF Series) and 2mm (MEC2 Series) pitches for edge-mount, right-angle and vertical applications.

Pricing on the BEC5 is approximately $0.10 per mated line.

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